Jun crown laser marking machine processing application potential has been highly valued. After years of development, has formed a series of laser processing technology, mainly used in the electronics industry and machinery manufacturing in two areas: in the electronics industry, laser processing for resistor trimming, substrate scribing, marking and semiconductor processing; machinery manufacturing field coding plastic laser marking, laser processing for cutting, hole set, welding, sheet Korea treatment (phase change than large, Xu deposited, fused and alloy ratio, etc.), cutting and other displays laser marking machine, in addition a variety of new laser processing technology is still emerging, such as the production of three-dimensional model, engraved anilox roll, enhanced plating, than learning vapor deposition, physical vapor deposition, narrow domain control. Laser processing technology development is inseparable from the development of laser devices. Mainstream laser machining or processing based on thermal effects. As a kind of laser beam machining hold heat energy compared with heat, and the traditional processing, with a range of features. Jun crown laser company equipment, including: fiber laser marking machine laser marking machines, semiconductor side pump laser marking machine, CO2 laser marking machine, end-pumped laser marking machine, metal laser cutting machine, laser welding machines, laser Stenciling, wire laser engraving machine, laser peeling machine, laser stripping machines, laser coders, and other industrial laser equipment. Laser marking machine has an important technical indicator is: Marking depth. Then, any one manufacturer in the technical parameters of the contract will be a column labeled marking depth, but marking only an approximate depth value is not anything that can achieve such a depth, the actual marking depth are different substances have different marking depth. But this is not a problem of laser above contemplated herein marking machine marking machine, the main problem is that under the same kind of material, with a marking machine, how to improve the marking depth? Here I mainly talk about the semiconductor marking machine. The first is how the semiconductor laser marking machine marking bit deeper? For now, hit the market in the marking machine carved deep semiconductor marking machine, the price is slightly more expensive, but in terms of real depth, not very deep, just marking time shortened. Laser beam quality, the use of it into TEM00 mode, the spot light when the divergence angle and smaller. The main way to improve the beam quality of the laser oscillation has elongated optical cavity, such as are currently in 80CM laser-based optical bench, can become 1.2 m length of the optical bench. There is a way to increase the uniformity of cooling capacity, such as YAG rod cooling, 808BAR strip cooling, and refrigeration improve the uniformity of the beam quality of the laser will rise, and the third way is to add the light path an aperture stop. Use high-quality optical lenses. This is important, the main optical lens and field lens includes a beam expander. Correction intact beam expander will be used to achieve the desired effect spot. The rational design of field lens, making it more energy after laser sharp focus. That is why after the use of German-made lenses and lens, there are differences in the marking machine power energy why. If you need help, please contact Jun crown laser fiber laser marking machine, laser crown Jun (certified), Shijie laser marking machine provided by Dongguan Jun Laser Equipment Co. crown. Dongguan Guan Jun Laser Equipment Co., Ltd. (www.dgaprime.com) is a leader in Dongguan, Guangdong, machinery and industrial products cooperation projects over the years, the company is implementing the scientific management, innovation and development, the principle of honesty and trustworthiness, and satisfy customers needs. Jun crown laser leadership with the staff warmly welcome all inquiries negotiations to create the crown Jun laser a better future.