Key laser engraving machine, bright laser engraving machine, laser engraving machine keyboard (view) provided by Dongguan Guan Jun Laser Equipment Limited. Key laser engraving machine, bright laser engraving machine, laser engraving machine keyboard (view) is Dongguan Guan Jun Laser Equipment Co., Ltd. (www.aprimelaser.com) launched this new upgrade, above pictures for reference only, please Dial telephone or pictures on this page, for the latest information, contact: Lee students. Dongguan crown Jun is a large-scale laser marking machine manufacturer in Guangdong, products include: fiber laser marking machine, two-dimensional code marking machine, C02 laser marking machine laser marking machine Cautions first, laser marking machine should be used whenever possible in a clean, 10 ℃ -35 ℃ environment plating laser engraving machine, keep the optics dry, dust-free. Usually separate enclosed workplaces need to ensure the transparent laser engraving machine, to ensure that the indoor temperature, the ground have to paint or tiles, installation of air conditioning; second, the customer must provide the main power supply to support at least 2500W AC single phase power, and I Division provides the main power line equipment shall be installed on an air switch, in order to make protection, prohibited the use of the triangular plug; and third, to provide customers with a ground mains shall be prohibited virtual access! Fourth, the circulating cooling water tank is best to use deionized water, the absence of deionized water, distilled water can be used instead; circulating cooling water after a period of time should be replaced (recommended at least change the water every two weeks), so as not to affect the efficiency of the laser . Industry Applications: 1, applies to the surface of glass, polymer materials, such as marking, micro machining. 2, widely used in food, pharmaceuticals, cosmetics, wires and other polymer materials bottles (box) surface marking and coding micropores (pore d≤10μm). 3, a flexible PCB board, LCD, TFT marking, scribing cutting. 4, a metal or non-metallic coating is removed. 5, microporous silicon wafer, blind hole machining.